I am currently a Ph.D. student in the Department of Electrical and Computer Engineering, at George Mason University, under the supervision of Prof. Weiwen Jiang. I also work closely with Prof. Yiyu Shi at the University of Notre Dame, Prof. Jingtong Hu at the University of Pittsburgh, and Prof. Lei Yang at George Mason University. CV
I received my Bachelor’s degree from Jilin University, China, and my Master’s from Universitat Politècnica de Catalunya in Spain.
I will join Bellini College of Artificial Intelligence, Cybersecurity and Computing at the University of South Florida in Fall 2025. I am looking for 1-2 PhD students with full financial support (TA/RA positions) starting in Fall 2025. If you are interested, please email me at shengy244@gmail.com with the following materials: CV, Transcripts, TOEFL(IELTS) (if available)!
📝 Research Interest
Design Automation (System) + Medical (Domain) + AI (Method) = Efficient Medical AI System
-Summary: My research agenda is anchored in advancing AI technology in the medical domain. I actively engage in Electronic Design Automation (EDA) for AI systems, medical image computing, and AI fairness.
My research goal is to bridge the practice gap between AI and domain applications, especially in achieving fair, energy-efficient, and time-efficient Medical AI Systems.
📝 Professional Experience
-TPC Member at IEEE Computer Society Annual Symposium on VLSI (ISLVLSI 2024, 2025)
-Journal Reviewer for IEEE Transactions on Circuits and Systems II
-Journal Reviewer for Journal Reviewer for IEEE Access
-Major Organizer of 1st ESFair Challenge at ESWEEK 2023
One of the major organizers for the ‘Classification Track: Fair and Intelligent Embedded System Challenge (ESFair)’, at the first Tiny and Fair ML Design Contest, co-located at the Embedded Systems Week (ESWEEK) 2023. ESFair’23 was sponsored by the Council on Electronic Design Automation (CEDA). 23 Teams from over 20 organizations participated in ESFair’23.
🔥 News
- 2025.03: 🎉 Join the University of South Florida (USF) In the Fall 2025
- 2024.12: 🎉🎉 One paper is accepted by AAAI 2025
- 2024.09: Tutorial on Novel Toolkits toward AI for Science on Resource-Constrained Computing Systems at ESWEEK 2024
- 2024.07: 🎉🎉 Two papers are accepted by MICCAI 2024
- 2024.06: We give the tutorial of Deep Learning Techniques for Wave-Based Imaging at SIAM 2024
- 2024.02: 🎉🎉 One paper is accepted by DAC 2024
📝 Teaching
-ECE285, Electric Circuit Analysis I. (Undergraduate Level)
-ECE350, Embedded Systems and Hardware Interfaces. (Undergraduate Level)
-ECE618, Hardware Accelerators for Machine Learning. (Graduate Level)
📝 Selected Publications
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Toward Fair Ultrasound Computing Tomography: Challenges, Solutions and Outlook, Sheng Y, Yang J, Lin Y, Jiang W, Yang L
In Proceedings of the Great Lakes Symposium on VLSI 2024 (pp. 748-753).
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Data-Algorithm-Architecture Co-Optimization for Fair Neural Networks on Skin Lesion Dataset, Sheng Y, Yang L, Li J, James J, Xu X, Shi Y, Hu J, Jiang W and Yang L
Accepted by the International Conference on Medical Image Computing and Computer-Assisted Intervention 2024 (MICCAI 2024)
Acceptance rate: 858/2771=31%
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APS-USCT: Ultrasound Computed Tomography on Sparse Data via AI-Physic Synergy, Sheng Y, Wang H, Liu Y, Yang J, Jiang W, Lin Y, Yang L
Accepted by the International Conference on Medical Image Computing and Computer-Assisted Intervention 2024 (MICCAI 2024)
Acceptance rate: 858/2771=31%
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Fast and Fair Medical AI on the Edge Through Neural Architecture Search for Hybrid Vision Models Yang C∗, Sheng Y, Dong P∗, Kong Z, Li Y, Yu P, Yang L, Lin X, Wang Y
In 2023 IEEE/ACM International Conference on Computer-Aided Design (ICCAD) 2023 Oct 28 (pp. 01-09). IEEE.
Acceptance rate: 172/750=22.9%
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Muffin: A framework toward multi-dimension AI fairness by uniting off-the-shelf models, Sheng Y, Yang J, Yang L, Shi Y, Hu J, Jiang W
In 60th ACM/IEEE Design Automation Conference (DAC) 2023 Jul 9 (pp. 1-6). IEEE.
Acceptance rate: 263/1156=22.7%
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Late Breaking Results: Fast Fair Medical Applications? Hybrid Vision Models Achieve the Fairness on the Edge, Yang C∗, Sheng Y∗, Dong P∗, Kong Z, Li Y, Yu P, Yang L, Lin X
In 2023 60th ACM/IEEE Design Automation Conference (DAC) (pp. 1-2). IEEE.
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Toward fair and efficient hyperdimensional computing, Sheng Y, Yang J, Jiang W, Yang L
In Proceedings of the 28th Asia and South Pacific Design Automation Conference (ASP-DAC) 2023 Jan 16 (pp. 612-617).
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The larger the fairer? small neural networks can achieve fairness for edge devices, Sheng Y, Yang J, Wu Y, Mao K, Shi Y, Hu J, Jiang W, Yang L
In Proceedings of the 59th ACM/IEEE Design Automation Conference (DAC) 2022 Jul 10 (pp. 163-168).
Acceptance rate: 223/987=22.6%
🎖 Honors and Awards
- 2022.06 DAC Young Fellow
- 2023.02 Best Poster Award in Student Research Forum at ASP-DAC for “On-Device AI Fairness”
- 2023.07 DAC Young Fellow
📖 Educations
- 2021.08 - now, George Mason University (expected 2025)
- 2018.09 - 2021.05, Universitat Politècnica de Catalunya
- 2012.09 - 2016.06, Jilin University
💬 Invited Talks
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2022., Gave the talk of [The Larger The Fairer? Small Neural Networks Can Achieve Fairness for Edge Devices] at [DAC 2022]
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2023, Gave the talk of [Muffin: A Framework Toward Multi-Dimension AI Fairness by Uniting Off-the-Shelf Models] at [DAC 2023]
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2023, Gave the talk of [Toward Fair and Efficient Hyperdimensional Computing] at [ASP-DAC 2023]
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2024, Gave the talk on [Ultrasound Computed Tomography on Sparse Data via AI-Physic Synergy] at [ESWEEK 2024]